2020-02-05 (MFG)The R&D project titled “AI Vision-Oriented Automatic Wafer Surface Inspection Machine” was submitted to the Taiwan Industry Innovation Platform of MOEA for review and approval, and the contract was officially signed

The AI vision-oriented Automatic Wafer Surface Inspection Machine developed by our company intelligently can upgrade the wafer production process and equipment, break through the limitation by imported equipment at the inspection site, supplement the deficiency due to manual inspection, improve quality control, automatically classify defects through big data and deep learning technology, predict faulty section of the process, and expand other system extension needs based on technical advantages. It has the competitive advantages in providing Total Solution and establishing differentiation, to help the localization and branding of semiconductor testing equipment in our country and increase the domestic production rate of semiconductor equipment.